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Anna Topol
Anna Topol
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Title
Cited by
Cited by
Year
Three-dimensional integrated circuits
AW Topol, DC La Tulipe, L Shi, DJ Frank, K Bernstein, SE Steen, A Kumar, ...
IBM Journal of Research and Development 50 (4.5), 491-506, 2006
9172006
Stable SRAM cell design for the 32 nm node and beyond
L Chang, DM Fried, J Hergenrother, JW Sleight, RH Dennard, ...
Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005., 128-129, 2005
8682005
Three-dimensional silicon integration
JU Knickerbocker, PS Andry, B Dang, RR Horton, MJ Interrante, CS Patel, ...
IBM Journal of Research and Development 52 (6), 553-569, 2008
5672008
High density chip carrier with integrated passive devices
MP Chudzik, RH Dennard, R Divakaruni, BK Furman, R Jammy, ...
US Patent 7,030,481, 2006
3762006
Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
AW Topol, DC La Tulipe, L Shi, SM Alam, DJ Frank, SE Steen, J Vichiconti, ...
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest …, 2005
3712005
Layer transfer process and functionally enhanced integrated circuits produced thereby
BK Furman, S Purushothaman, M Sankarapandian, A Topol
US Patent 7,855,101, 2010
3422010
High density chip carrier with integrated passive devices
MP Chudzik, RH Dennard, R Divakaruni, BK Furman, R Jammy, ...
US Patent 6,962,872, 2005
3332005
Layer Transfer Process and Functionally Enhanced Integrated Circuits Products Thereby
BK Furman, S Purushothaman, M Sankarapandian, A Topol
US Patent App. 11/746,680, 2008
2812008
Methods of forming wiring to transistor and related transistor
DJ Frank, DC La Tulipe Jr, SE Steen, AW Topol
US Patent 7,666,723, 2010
2752010
Techniques for Layer Transfer Processing
S Bedell, K Fogel, B Furman, S Purushothaman, D Sadana, A Topol
US Patent App. 11/840,389, 2007
2742007
Overlay as the key to drive wafer scale 3D integration
SE Steen, D LaTulipe, AW Topol, DJ Frank, K Belote, D Posillico
Microelectronic engineering 84 (5-8), 1412-1415, 2007
2702007
Techniques for layer transfer processing
S Bedell, K Fogel, B Furman, S Purushothaman, D Sadana, A Topol
US Patent App. 10/685,636, 2005
2502005
Electrical integrity of state-of-the-art 0.13/spl mu/m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
KW Guarini, AW Topol, M Ieong, R Yu, L Shi, MR Newport, DJ Frank, ...
Digest. International Electron Devices Meeting,, 943-945, 2002
2062002
Servo control circuit for detecting analytes via nanoparticle-labeled substances with electromagnetic read-write heads
TL Awezec, DJ Boday, SL Schwartz, AW Topol, DJ Winarski
US Patent 8,694,280, 2014
1062014
Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures
AW Topol, BK Furman, KW Guarini, L Shi, GM Cohen, GF Walker
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
962004
Structure, design and process control for Cu bonded interconnects in 3D integrated circuits
KN Chen, SH Lee, PS Andry, CK Tsang, AW Topol, YM Lin, JQ Lu, ...
2006 International Electron Devices Meeting, 1-4, 2006
902006
Transistor scaling with novel materials
M Ieong, V Narayanan, D Singh, A Topol, V Chan, Z Ren
Materials today 9 (6), 26-31, 2006
772006
Highly scalable and distributed data sharing and storage
S Oehme, MT Roskow, SL Schwartz, AW Topol, DJ Winarski
US Patent 8,935,431, 2015
482015
Hermetic seal and reliable bonding structures for 3d applications
KN Chen, BK Furman, EJ Sprogis, AW Topol, CK Tsang, MR Wordeman, ...
US Patent App. 11/534,366, 2008
342008
Structure and method of forming electrodeposited contacts
C Cabral Jr, H Deligianni, RF Knarr, SG Malhotra, S Rossnagel, X Shao, ...
US Patent 7,405,154, 2008
332008
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