Evaluation of size effect on mechanical properties of single crystal silicon by nanoscale bending test using AFM T Namazu, Y Isono, T Tanaka Journal of Microelectromechanical systems 9 (4), 450-459, 2000 | 478 | 2000 |
Strength of carbon nanotubes depends on their chemical structures A Takakura, K Beppu, T Nishihara, A Fukui, T Kozeki, T Namazu, ... Nature communications 10 (1), 3040, 2019 | 182 | 2019 |
Plastic deformation of nanometric single crystal silicon wire in AFM bending test at intermediate temperatures T Namazu, Y Isono, T Tanaka Journal of Microelectromechanical Systems 11 (2), 125-135, 2002 | 142 | 2002 |
Mechanical property measurements of nanoscale structures using an atomic force microscope S Sundararajan, B Bhushan, T Namazu, Y Isono Ultramicroscopy 91 (1-4), 111-118, 2002 | 131 | 2002 |
Fatigue life prediction criterion for micro–nanoscale single-crystal silicon structures T Namazu, Y Isono Journal of Microelectromechanical Systems 18 (1), 129-137, 2008 | 76 | 2008 |
Development of AFM tensile test technique for evaluating mechanical properties of sub-micron thick DLC films Y Isono, T Namazu, N Terayama Journal of Microelectromechanical systems 15 (1), 169-180, 2006 | 66 | 2006 |
Piezoresistive effect in p-type 3C-SiC at high temperatures characterized using Joule heating HP Phan, T Dinh, T Kozeki, A Qamar, T Namazu, S Dimitrijev, NT Nguyen, ... Scientific reports 6 (1), 28499, 2016 | 64 | 2016 |
Characterization of single crystal silicon and electroplated nickel films by uniaxial tensile test with in situ X‐ray diffraction measurement T Namazu, S Inoue Fatigue & Fracture of Engineering Materials & Structures 30 (1), 13-20, 2007 | 60 | 2007 |
Self-propagating explosive reactions in nanostructured Al/Ni multilayer films asalocalized heat process technique formems T Namazu, H Takemoto, H Fujita, Y Nagai, S Inoue 19th IEEE international conference on micro electro mechanical systems, 286-289, 2006 | 60 | 2006 |
Strain-induced reversible modulation of the magnetic anisotropy in perpendicularly magnetized metals deposited on a flexible substrate S Ota, Y Hibino, D Bang, H Awano, T Kozeki, H Akamine, T Fujii, ... Applied Physics Express 9 (4), 043004, 2016 | 53 | 2016 |
Quasi-static bending test of nano-scale SiO2 wire at intermediate temperatures using AFM-based technique T Namazu, Y Isono Sensors and Actuators A: Physical 104 (1), 78-85, 2003 | 53 | 2003 |
Thermomechanical tensile characterization of Ti–Ni shape memory alloy films for design of MEMS actuator T Namazu, A Hashizume, S Inoue Sensors and Actuators A: Physical 139 (1-2), 178-186, 2007 | 48 | 2007 |
Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure HP Phan, KM Dowling, TK Nguyen, T Dinh, DG Senesky, T Namazu, ... Materials & Design 156, 16-21, 2018 | 46 | 2018 |
The piezoresistive effect in top–down fabricated p-type 3C-SiC nanowires HP Phan, T Dinh, T Kozeki, TK Nguyen, A Qamar, T Namazu, NT Nguyen, ... IEEE Electron Device Letters 37 (8), 1029-1032, 2016 | 45 | 2016 |
Mechanical properties of polycrystalline titanium nitride films measured by XRD tensile testing T Namazu, S Inoue, H Takemoto, K Koterazawa IEEJ Transactions on Sensors and Micromachines 125 (9), 374-379, 2005 | 43 | 2005 |
Piezoresistive effect of p-type silicon nanowires fabricated by a top-down process using FIB implantation and wet etching HP Phan, T Kozeki, T Dinh, T Fujii, A Qamar, Y Zhu, T Namazu, ... RSC advances 5 (100), 82121-82126, 2015 | 40 | 2015 |
Nano strain-amplifier: Making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects HP Phan, T Dinh, T Kozeki, TK Nguyen, A Qamar, T Namazu, NT Nguyen, ... Applied Physics Letters 109 (12), 2016 | 38 | 2016 |
Thermoresistive properties of p-type 3C–SiC nanoscale thin films for high-temperature MEMS thermal-based sensors T Dinh, HP Phan, T Kozeki, A Qamar, T Namazu, NT Nguyen, DV Dao RSC advances 5 (128), 106083-106086, 2015 | 36 | 2015 |
Nano-scale bending test of Si beam for MEMS T Namazu, Y Isono, T Tanaka Proceedings IEEE Thirteenth Annual International Conference on Micro Electro …, 2000 | 35 | 2000 |
Influences of exothermic reactive layer and metal interlayer on fracture behavior of reactively bonded solder joints T Namazu, K Ohtani, S Inoue, S Miyake Journal of Engineering Materials and Technology 137 (3), 031011, 2015 | 34 | 2015 |