Takahiro Namazu
Takahiro Namazu
Professor, Kyoto University of Advanced Science
Verified email at - Homepage
Cited by
Cited by
Evaluation of size effect on mechanical properties of single crystal silicon by nanoscale bending test using AFM
T Namazu, Y Isono, T Tanaka
Journal of Microelectromechanical systems 9 (4), 450-459, 2000
Strength of carbon nanotubes depends on their chemical structures
A Takakura, K Beppu, T Nishihara, A Fukui, T Kozeki, T Namazu, ...
Nature communications 10 (1), 3040, 2019
Plastic deformation of nanometric single crystal silicon wire in AFM bending test at intermediate temperatures
T Namazu, Y Isono, T Tanaka
Journal of Microelectromechanical Systems 11 (2), 125-135, 2002
Mechanical property measurements of nanoscale structures using an atomic force microscope
S Sundararajan, B Bhushan, T Namazu, Y Isono
Ultramicroscopy 91 (1-4), 111-118, 2002
Fatigue life prediction criterion for micro–nanoscale single-crystal silicon structures
T Namazu, Y Isono
Journal of Microelectromechanical Systems 18 (1), 129-137, 2008
Development of AFM tensile test technique for evaluating mechanical properties of sub-micron thick DLC films
Y Isono, T Namazu, N Terayama
Journal of Microelectromechanical systems 15 (1), 169-180, 2006
Piezoresistive effect in p-type 3C-SiC at high temperatures characterized using Joule heating
HP Phan, T Dinh, T Kozeki, A Qamar, T Namazu, S Dimitrijev, NT Nguyen, ...
Scientific reports 6 (1), 28499, 2016
Characterization of single crystal silicon and electroplated nickel films by uniaxial tensile test with in situ X‐ray diffraction measurement
T Namazu, S Inoue
Fatigue & Fracture of Engineering Materials & Structures 30 (1), 13-20, 2007
Self-propagating explosive reactions in nanostructured Al/Ni multilayer films asalocalized heat process technique formems
T Namazu, H Takemoto, H Fujita, Y Nagai, S Inoue
19th IEEE international conference on micro electro mechanical systems, 286-289, 2006
Strain-induced reversible modulation of the magnetic anisotropy in perpendicularly magnetized metals deposited on a flexible substrate
S Ota, Y Hibino, D Bang, H Awano, T Kozeki, H Akamine, T Fujii, ...
Applied Physics Express 9 (4), 043004, 2016
Quasi-static bending test of nano-scale SiO2 wire at intermediate temperatures using AFM-based technique
T Namazu, Y Isono
Sensors and Actuators A: Physical 104 (1), 78-85, 2003
Thermomechanical tensile characterization of Ti–Ni shape memory alloy films for design of MEMS actuator
T Namazu, A Hashizume, S Inoue
Sensors and Actuators A: Physical 139 (1-2), 178-186, 2007
Highly sensitive pressure sensors employing 3C-SiC nanowires fabricated on a free standing structure
HP Phan, KM Dowling, TK Nguyen, T Dinh, DG Senesky, T Namazu, ...
Materials & Design 156, 16-21, 2018
The piezoresistive effect in top–down fabricated p-type 3C-SiC nanowires
HP Phan, T Dinh, T Kozeki, TK Nguyen, A Qamar, T Namazu, NT Nguyen, ...
IEEE Electron Device Letters 37 (8), 1029-1032, 2016
Mechanical properties of polycrystalline titanium nitride films measured by XRD tensile testing
T Namazu, S Inoue, H Takemoto, K Koterazawa
IEEJ Transactions on Sensors and Micromachines 125 (9), 374-379, 2005
Piezoresistive effect of p-type silicon nanowires fabricated by a top-down process using FIB implantation and wet etching
HP Phan, T Kozeki, T Dinh, T Fujii, A Qamar, Y Zhu, T Namazu, ...
RSC advances 5 (100), 82121-82126, 2015
Nano strain-amplifier: Making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects
HP Phan, T Dinh, T Kozeki, TK Nguyen, A Qamar, T Namazu, NT Nguyen, ...
Applied Physics Letters 109 (12), 2016
Thermoresistive properties of p-type 3C–SiC nanoscale thin films for high-temperature MEMS thermal-based sensors
T Dinh, HP Phan, T Kozeki, A Qamar, T Namazu, NT Nguyen, DV Dao
RSC advances 5 (128), 106083-106086, 2015
Nano-scale bending test of Si beam for MEMS
T Namazu, Y Isono, T Tanaka
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro …, 2000
Influences of exothermic reactive layer and metal interlayer on fracture behavior of reactively bonded solder joints
T Namazu, K Ohtani, S Inoue, S Miyake
Journal of Engineering Materials and Technology 137 (3), 031011, 2015
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