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Hui-Ming ChengShenyang National Laboratory for Materials Science, Institute of Metal Research, CASVerified email at imr.ac.cn
Goki EdaNational University of SingaporeVerified email at nus.edu.sg
Yung-Chang LinAISTVerified email at aist.go.jp
Zhipei SunProfessor, Aalto UniversityVerified email at aalto.fi
Jing WuProfessor, School of Electronic Science & Engineering, Southeast University, ChinaVerified email at seu.edu.cn
Weijie ZhaoProfessor, School of Physics, Southeast UniversityVerified email at seu.edu.cn
Wencai Ren (任文才)Shenyang National Laboratory for Materials Science, Institute of Metal Research, CASVerified email at imr.ac.cn
Dai-Ming TangWPI-MANA, National Institute for Materials Science (NIMS)Verified email at nims.go.jp
Hu ZehuaNanjing UniversityVerified email at nus.edu.sg
Leiqiang ChuVerified email at u.nus.edu
Andrew T S WeeDepartment of Physics, National University of SingaporeVerified email at nus.edu.sg
WEI CHENProfessor, Department of Chemistry, National University of SingaporeVerified email at nus.edu.sg
Wan-Jing YuSchool of Metallurgy and Environment, Central South UniversityVerified email at cam.ac.uk
Ivan VerzhbitskiyInstitute of Materials Research and Engineering, SingaporeVerified email at imre.a-star.edu.sg
Dmitri GolbergDistinguished Professor, Queensland University of Technology (QUT), Brisbane, AustraliaVerified email at qut.edu.au
Yoshio BandoKing Saud University, University of WollongongVerified email at uow.edu.au
Wei LvTsinghua Shenzhen International Graduate School, Tsinghua UniversityVerified email at sz.tsinghua.edu.cn
Robert I. WoodwardToshiba Europe Ltd, UKVerified email at toshiba.eu
Rupert OultonImperial College LondonVerified email at imperial.ac.uk
Tianyuan LiuReynolds American IncVerified email at rjrt.com