| Ultrasmall integrated 3D micro‐supercapacitors solve energy storage for miniature devices C Meng, J Maeng, SWM John, PP Irazoqui Advanced Energy Materials 4 (7), 1301269, 2014 | 192 | 2014 |
| Three-dimensional microcavity array electrodes for high-capacitance all-solid-state flexible microsupercapacitors J Maeng, YJ Kim, C Meng, PP Irazoqui ACS applied materials & interfaces 8 (21), 13458-13465, 2016 | 51 | 2016 |
| Responsive, 3D Electronics Enabled by Liquid Crystal Elastomer Substrates H Kim*, J Gibson*, J Maeng*, M Saed, K Pimentel, R Rihani, JJ Pancrazio, ... ACS applied materials & interfaces, 2019 | 36 | 2019 |
| A millimeter-wave system-on-package technology using a thin-film substrate with a flip-chip interconnection S Song, Y Kim, J Maeng, H Lee, Y Kwon, KS Seo IEEE transactions on advanced packaging 32 (1), 101-108, 2009 | 34 | 2009 |
| Eyeglasses-powered, contact lens-like platform with high power transfer efficiency YJ Kim*, J Maeng*, PP Irazoqui Biomedical microdevices 17 (4), 75, 2015 | 33 | 2015 |
| High‐charge‐capacity sputtered iridium oxide neural stimulation electrodes deposited using water vapor as a reactive plasma constituent J Maeng*, B Chakraborty*, N Geramifard, T Kang, RT Rihani, ... Journal of Biomedical Materials Research Part B: Applied Biomaterials 108 (3 …, 2020 | 32 | 2020 |
| Chronic recording and electrochemical performance of amorphous silicon carbide-coated Utah electrode arrays implanted in rat motor cortex A Joshi-Imre, BJ Black, J Abbott, A Kanneganti, R Rihani, B Chakraborty, ... Journal of neural engineering 16 (4), 046006, 2019 | 28 | 2019 |
| From softening polymers to multimaterial based bioelectronic devices M Ecker, A Joshi-Imre, R Modi, CL Frewin, A Garcia-Sandoval, J Maeng, ... Multifunctional Materials 2 (1), 012001, 2018 | 27 | 2018 |
| Super-capacitor and arrangement for miniature implantable medical devices PP Irazoqui, O Gall, C Meng, J Maeng US Patent 10,176,933, 2019 | 23 | 2019 |
| Electrochemical characteristics of ultramicro-dimensioned SIROF electrodes for neural stimulation and recording A Ghazavi, J Maeng, M Black, S Salvi, SF Cogan Journal of neural engineering 17 (1), 016022, 2020 | 22 | 2020 |
| Liquid crystal elastomers as substrates for 3D, robust, implantable electronics J Maeng*, RT Rihani*, M Javed, JS Rajput, H Kim, IG Bouton, TA Criss, ... Journal of Materials Chemistry B, 2020 | 17 | 2020 |
| Parylene interposer as thin flexible 3-D packaging enabler for wireless applications J Maeng, B Kim, D Ha, WJ Chappell IEEE transactions on microwave theory and techniques 59 (12), 3410-3418, 2011 | 17 | 2011 |
| Wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible biomedical platform J Maeng, C Meng, PP Irazoqui Biomedical microdevices 17, 1-10, 2015 | 14 | 2015 |
| Deployable, liquid crystal elastomer-based intracortical probes RT Rihani, AM Stiller, JO Usoro, J Lawson, H Kim, BJ Black, VR Danda, ... Acta Biomaterialia 111, 54-64, 2020 | 12 | 2020 |
| Effect of oxidation on intrinsic residual stress in amorphous silicon carbide films F Deku, S Mohammed, A Joshi‐Imre, J Maeng, V Danda, TJ Gardner, ... Journal of Biomedical Materials Research Part B: Applied Biomaterials 107 (5 …, 2019 | 12 | 2019 |
| From Chaos to Control: Programmable Crack Patterning with Molecular Order in Polymer Substrates H Kim, MK Abdelrahman, J Choi, H Kim, J Maeng, S Wang, M Javed, ... Advanced Materials 33 (22), 2008434, 2021 | 11 | 2021 |
| Effect of annealing atmosphere on IGZO thin film transistors on a deformable softening polymer substrate G Gutierrez-Heredia, J Maeng, J Conde, O Rodriguez-Lopez, WE Voit Semiconductor Science and Technology 33 (9), 095001, 2018 | 11 | 2018 |
| High-performance millimeter-wave SOP technology with flip-chip interconnection S Song, J Maeng, H Lee, KS Seo 2007 Proceedings 57th Electronic Components and Technology Conference, 1007-1013, 2007 | 11 | 2007 |
| Indium–Gallium–Zinc Oxide Schottky Diodes operating across the glass transition of stimuli‐responsive polymers E Guerrero, A Polednik, M Ecker, A Joshi‐Imre, W Choi, ... Advanced Electronic Materials 6 (4), 1901210, 2020 | 10 | 2020 |
| Embedded Decoupling Capacitors up to 80 nF on Multichip Module-Deposited with Quasi-Three-Dimensional Metal–Insulator–Metal Structure J Maeng, S Song, N Jeon, CS Yoo, H Lee, K Seo Japanese journal of applied physics 47 (4S), 2535, 2008 | 10 | 2008 |
Pedro IrazoquiElectrical and Computer Engineering, Johns Hopkins UniversityVerified email at jhu.edu
