Get my own profile
Public access
View all12 articles
0 articles
available
not available
Based on funding mandates
Co-authors
Pedro IrazoquiElectrical and Computer Engineering, Johns Hopkins UniversityVerified email at jhu.edu
Stuart CoganUniversity of Texas at DallasVerified email at utdallas.edu
Alexandra Joshi-ImreSenior Process Engineer, The University of Texas at DallasVerified email at alumni.nd.edu
Rashed RihaniResearch and Development Scientist at PhilipsVerified email at philips.com
Taylor WareAssociate Professor, Biomedical Engineering, Materials Science and Engineering, Texas A&M UniversityVerified email at tamu.edu
Hyun KimKorea Research Institute of Chemical TechnologyVerified email at krict.re.kr
Joseph PancrazioUniversity of Texas at DallasVerified email at utdallas.edu
Bitan Chakraborty, PhDThin Film Module Engineer, Intel Corporation | The University of Texas at DallasVerified email at intel.com
Chuizhou Meng (孟垂舟)Mechatronic Engineering, Hebei University of TechnologyVerified email at hebut.edu.cn
Young-Joon KimGachon UniversityVerified email at gachon.ac.kr
Bryan James BlackAssistant Professor, the University of Massachusetts LowellVerified email at uml.edu
Walter VoitUniversity of Texas at DallasVerified email at utdallas.edu
Dohyuk HaSamsung ElectronicsVerified email at samsung.com
Melanie EckerAssistant Professor in the Department of Biomedical Engineering at the University of North TexasVerified email at unt.edu
Oren Z GallThe Pennsylvania State UniversityVerified email at psu.edu
Mustafa K. AbdelrahmanResearch Assistant, Texas A&M UniversityVerified email at tamu.edu
Mohand SaedUniversity of Cambridge, Cavendish LaboratoryVerified email at cam.ac.uk
Dr. Sandeep NegiUniversity of Utah, Blackrock MicrosystemsVerified email at utah.edu
Aswini KannegantiDoctoral studentVerified email at utdallas.edu
Loren RiethAssociate Professor, Mechanical and Aerospace Engineering, West Virginia UniversityVerified email at mix.wvu.edu