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Co-authors
- XinQuan ZHANGAssociate Professor, Shanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
- Yi ZhangUniversity of East Anglia and SUSTechVerified email at mail.sustech.edu.cn
- Yongjie ZhangPhD candidate, National University of Singapore & Southern University of Science and TechnologyVerified email at u.nus.edu
- Muhammad Ajmal KhanGeorge Mason UniversityVerified email at gmu.edu
- Nobuyuki ZettsuShinshu UniversityVerified email at shinshu-u.ac.jp
- LIU Kui (K Liu)Senior Scientist, Singapore Institute of Manufacturing TechnologyVerified email at simtech.a-star.edu.sg
- D LiuVerified email at uea.ac.uk
- Huang Rui 黄锐Singapore Institute of Manufacturing Technology (SIMTech)Verified email at simtech.a-star.edu.sg
- nian liuOsaka university in JapanVerified email at pm.prec.eng.osaka-u.ac.jp
- Fang WangThe university of hong kongVerified email at connect.hku.hk
- Fang ZhidongDivision of Materials and Manufacturing Science, Graduate School of Engineering, Osaka UniversityVerified email at mat.eng.osaka-u.ac.jp
- WEIJIA GUONational University of SingaporeVerified email at u.nus.edu
- Fengzhou FangTJU and UCDVerified email at tju.edu.cn
- A Senthil KumarNational University of SingaporeVerified email at nus.edu.sg
- Jiaming BaiSouthern University of Science and TechnologyVerified email at sustech.edu.cn
- Dennis Wee Keong NeoSingapore Institute of Manufacturing TechnologyVerified email at u.nus.edu
- Hirotaka SatoNanyang Technological UniversityVerified email at ntu.edu.sg
- Yongguang WangSoochow UniversityVerified email at suda.edu.cn
- Shuai WangSouthern University of Science and TechnologyVerified email at sustech.edu.cn
- Anderson Ho Cheung ShumProfessor of Mechanical Engineering, University of Hong KongVerified email at hku.hk