Self-cleaning of superhydrophobic surfaces by self-propelled jumping condensate KM Wisdom, JA Watson, X Qu, F Liu, GS Watson, CH Chen Proceedings of the National Academy of Sciences 110 (20), 7992-7997, 2013 | 593 | 2013 |
Hotspot cooling with jumping-drop vapor chambers KF Wiedenheft, HA Guo, X Qu, JB Boreyko, F Liu, K Zhang, F Eid, ... Applied Physics Letters 110 (14), 2017 | 140 | 2017 |
Self-propelled sweeping removal of dropwise condensate X Qu, JB Boreyko, F Liu, RL Agapov, NV Lavrik, ST Retterer, JJ Feng, ... Applied Physics Letters 106 (22), 221601, 2015 | 125 | 2015 |
Self-Propelled Droplet Removal from Hydrophobic Fiber-Based Coalescers K Zhang, F Liu, AJ Williams, X Qu, JJ Feng, CH Chen Physical Review Letters 115, 2015 | 97 | 2015 |
Enhanced flow boiling in microchannels through integrating multiple micro-nozzles and reentry microcavities W Li, X Qu, T Alam, F Yang, W Chang, J Khan, C Li Applied Physics Letters 110 (1), 2017 | 76 | 2017 |
Enhanced flow boiling in microchannels using auxiliary channels and multiple micronozzles (I): Characterizations of flow boiling heat transfer W Li, F Yang, T Alam, X Qu, B Peng, J Khan, C Li International Journal of Heat and Mass Transfer 116, 208-217, 2018 | 74 | 2018 |
Supercapillary Architecture‐Activated Two‐Phase Boundary Layer Structures for Highly Stable and Efficient Flow Boiling Heat Transfer W Li, Z Wang, F Yang, T Alam, M Jiang, X Qu, F Kong, AS Khan, M Liu, ... Advanced Materials 32 (2), 1905117, 2020 | 67 | 2020 |
Enhanced flow boiling in microchannels using auxiliary channels and multiple micronozzles (II): Enhanced CHF and reduced pressure drop W Li, T Alam, F Yang, X Qu, B Peng, J Khan, C Li International Journal of Heat and Mass Transfer 115, 264-272, 2017 | 35 | 2017 |
Wicking nanofence-activated boundary layer to enhance two-phase transport in microchannels W Li, F Yang, X Qu, C Li Langmuir 36 (51), 15536-15542, 2020 | 12 | 2020 |
Acoustically driven micro-thermal-bubble dynamics in a microspace X Qu, H Qiu Journal of Micromechanics and Microengineering 20 (9), 095012, 2010 | 11 | 2010 |
Bubble dynamics under a horizontal micro heater array X Qu, H Qiu Journal of Micromechanics and Microengineering 19 (9), 095008, 2009 | 11 | 2009 |
Thermal Bubble Dynamics Under the Effects of an Acoustic Field X Qu, H Qiu Heat Transfer Engineering 32 (7-8), 636-647, 2011 | 8 | 2011 |
Effects of acoustic vibration on microheater-induced vapor bubble incipience in a microchannel X Qu, H Qiu Journal of Micromechanics and Microengineering 21 (10), 105015, 2011 | 7 | 2011 |
Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods SU Arifeen, X Qu US Patent 11,587,918, 2023 | 4 | 2023 |
Apparatus and method for dissipating heat in multiple semiconductor device modules X Qu, SU Arifeen US Patent 11,011,449, 2021 | 4 | 2021 |
Assemblies including heat dispersing elements and related systems and methods X Qu | 3 | 2019 |
Enhanced flow boiling in microchannels using auxiliary channels and multiple micronozzles W Li, F Yang, T Alam, B Peng, X Qu, C Li International Conference on Micro/Nanoscale Heat Transfer 49651, V001T04A010, 2016 | 3 | 2016 |
Assemblies including heat dispersing elements and related systems and methods X Qu US Patent 11,617,284, 2023 | 2 | 2023 |
Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture X Qu US Patent 11,348,857, 2022 | 2 | 2022 |
Semiconductor devices with flexible connector array K Sinha, X Qu US Patent 11,348,875, 2022 | 2 | 2022 |