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Edward Davis
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Controlled release of tetracycline–HCl from halloysite–polymer composite films
CJ Ward, S Song, EW Davis
Journal of nanoscience and nanotechnology 10 (10), 6641-6649, 2010
632010
Nanoplatforms for targeted stimuli-responsive drug delivery: a review of platform materials and stimuli-responsive release and targeting mechanisms
Y Sun, E Davis
Nanomaterials 11 (3), 746, 2021
592021
Seed‐Mediated Growth of Gold Nanorods: Limits of Length to Diameter Ratio Control
CJ Ward, R Tronndorf, AS Eustes, ML Auad, EW Davis
Journal of Nanomaterials 2014 (1), 765618, 2014
582014
Am I an engineer yet? Perceptions of engineering and identity among first year students
JM Lakin, AH Wittig, EW Davis, VA Davis
European Journal of Engineering Education 45 (2), 214-231, 2020
452020
Facile fabrication of polydopamine nanotubes for combined chemo-photothermal therapy
Y Sun, EW Davis
Journal of Materials Chemistry B 7 (43), 6828-6839, 2019
412019
Fixation of the Achilles tendon insertion using suture button technology
NJ Fanter, EW Davis, CL Baker Jr
The American Journal of Sports Medicine 40 (9), 2085-2091, 2012
332012
Morphology of thermally polymerized microporous polymer materials prepared from methyl methacrylate and 2-hydroxyethyl methacrylate microemulsions
N Schmuhl, E Davis, HM Cheung
Langmuir 14 (4), 757-761, 1998
261998
Halloysite nanoclay for controlled release applications
CJ Ward, M DeWitt, EW Davis
Nanomaterials for biomedicine, 209-238, 2012
242012
Property-Performance Relationships for Sustained High Temperature Operation of Electronics
P Lall, Y Zhang, M Kasturi, H Wu, E Davis, J Suhling
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 257-268, 2020
232020
Effects of precursor composition on pore morphology for thermally polymerized acrylic acid/methyl methacrylate-based microemulsions
EW Davis, R Mukkamala, HM Cheung
Langmuir 14 (4), 762-767, 1998
231998
Effect of long term isothermal exposure on underfill material properties
P Lall, M Kasturi, H Wu, E Davis
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
212020
Bowl-shaped polydopamine nanocapsules: control of morphology via template-free synthesis
Y Sun, E Davis
Langmuir 36 (32), 9333-9342, 2020
202020
Influence of initial mixing methods on melt‐extruded single‐walled carbon nanotube–polypropylene nanocomposites
VK Radhakrishnan, EW Davis, VA Davis
Polymer Engineering & Science 50 (9), 1831-1842, 2010
192010
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
P Lall, M Kasturi, H Wu, J Suhling, E Davis
Journal of Electronic Packaging 144 (2), 021113, 2022
162022
Property-Performance Relationships for Sustained High Temperature Operation of Electronics. In2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020 Jun 3 …
P Lall, Y Zhang, M Kasturi, H Wu, E Davis, J Suhling
IEEE, 0
14
Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year
P Lall, Y Zhang, M Kasturi, P Choudhury, H Wu, J Suhling, E Davis
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 971-982, 2021
132021
Bacillus velezensis AP183 Inhibits Staphylococcus aureus Biofilm Formation and Proliferation in Murine and Bovine Disease Models
S Afroj, AD Brannen, S Nasrin, A Al Mouslem, T Hathcock, H Maxwell, ...
Frontiers in microbiology 12, 746410, 2021
122021
Evolution of Viscoelastic Properties of Underfills Exposed to High Temperature
P Lall, M Kasturi, H Wu, J Suhling, E Davis
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021
112021
Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging
P Lall, Y Zhang, H Wu, J Suhling, E Davis, J Williamson
International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021
92021
Evolution of Prony Parameters for Underfills Subjected to High Temperature Long Term Aging
P Lall, Y Zhang, H Wu, J Suhling, E Davis
International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021
92021
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Articles 1–20