| Microstructure and Microwave Dielectric Properties of TiO2‐Doped Zn2SiO4 Ceramics Synthesized Through the Sol–Gel Process M Dong, Z Yue, H Zhuang, S Meng, L Li Journal of the American Ceramic Society 91 (12), 3981-3985, 2008 | 79 | 2008 |
| Integrated Virtual Impactor Enabled PM2.5 Sensor M Dong, E Iervolino, F Santagata, G Zhang, G Zhang IEEE Sensors Journal 17 (9), 2814-2821, 2017 | 31 | 2017 |
| Silicon microfabrication based particulate matter sensor M Dong, E Iervolino, F Santagata, G Zhang, G Zhang Sensors and Actuators A: Physical 247, 115-124, 2016 | 26 | 2016 |
| Thermal analysis of remote phosphor in LED modules M Dong, J Wei, H Ye, C Yuan, K Zhang Journal of Semiconductors 34 (5), 053007, 2013 | 13 | 2013 |
| 3D system-in-package design using stacked silicon submount technology M Dong, F Santagata, R Sokolovskij, J Wei, C Yuan, G Zhang Microelectronics International 32 (2), 63-72, 2015 | 12 | 2015 |
| Effects of nitrogen on wettability and reliability of lead-free solder in reflow soldering M Dong, Y Wang, J Cai, T Feng, Y Pu 2009 International Conference on Electronic Packaging Technology & High …, 2009 | 12 | 2009 |
| Phase characterization and dielectric properties of Zn2SiO4 ceramics derived from a sol-gel process Z Yue, M Dong, S Meng, L Li Ferroelectrics 387 (1), 184-188, 2009 | 10 | 2009 |
| Novel system-in-package design and packaging solution for solid state lighting systems M Dong, F Santagata, J Wei, C Yuan, G Zhang 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1192-1197, 2014 | 2 | 2014 |
| Interfacial reaction of reballed BGAs under isothermal aging conditions L Nie, M Dong, J Cai, M Osterman, M Pecht 2009 International Conference on Electronic Packaging Technology & High …, 2009 | 1 | 2009 |
| Solderability of flash gold surface finish Y Wang, M Dong, J Cai 2009 International Conference on Electronic Packaging Technology & High …, 2009 | 1 | 2009 |
| Thermal analysis for silicon-based integration of LED systems M Dong, F Santagata, J Wei, C Yuan, K Zhang 2013 10th China International Forum on Solid State Lighting (ChinaSSL), 206-209, 2013 | | 2013 |
| Reliability of lead-free fine pitch BGA under thermal and mechanical impact M Dong, Q Wang, J Cai, J Li, S Wang 2011 6th International Microsystems, Packaging, Assembly and Circuits …, 2011 | | 2011 |
| Finite Element Method based stress analysis and warpage prediction of SIM card packaging M Dong, J Cai, Y Chen, Q Wang, X Dou, S Wang 2010 11th International Conference on Electronic Packaging Technology & High …, 2010 | | 2010 |
Guo Qi ZhangProfessor, delft university of technologyEmail được xác minh tại tudelft.nl
